View ZL6030407_1339234.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

ZL60304 Parallel Fiber Optic Transceiver (4 + 4) x 3.125 Gbps
Shortform Data Sheet
A full Data Sheet is available to qualified customers. To register, please send an email to opto@zarlink.com. Ordering Information ZL60304MLDC ZL60304MMDC Transceiver Transceiver with EMI-clip 0C to +80C
March 2007
*
Link reach with 50/125 m 500 MHz. km fiber, 300-m at 2.5 Gbps and 90-m at 3.125 Gbps Channel BER better than 10-12 Industry standard MPO/MTP ribbon fiber connector interface Pluggable MegArray(R) connector Laser class 1 M IEC 60825-1:2001 compliant Low power consumption, < 1 W Power supply 3.3 V
Features
* * * * * Compatible with POP4 MSA usage 4 Transmit channels and 4 Receive channels Data rate up to 3.125 Gbps per channel 850 nm VCSEL array Data I/O is CML compatible
* * * * * *
Rx_EN Rx_SD SQ_EN
VCCA Rx
VCCB Rx VEE Rx
DOUT0+ DOUT0DOUT3+ DOUT3DIN3+ DIN3-
TransImpedance and Limiting Amplifier
RX0 0
PIN Array
RX1 1
2 RX2 3 RX3 3TX3 2TX2 1 TX1 0 TX0
VCSEL Driver
VCSEL Array
DIN0+ DIN0VCSEL Driver Controller
Tx_EN
Tx_DIS
RESET
FAULT
VCC Tx
VEE TX
Figure 1 - Transceiver Block Diagram
1
Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2007, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60304
Applications
* * * * * * *
Shortform Data Sheet
High-speed interconnects within and between switches, routers and transport equipment Server-Server Clusters, Super-computing interconnections InfiniBand 4x-SX compliant Fibre Channel connections XAUI based interconnections Proprietary backplanes Interconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane
Description
The ZL60304 is a very high-speed transceiver for parallel fiber applications. This transceiver performs E/O and O/E conversions for data transmission over multimode fiber ribbon. The ZL60304 provides an effective solution for XAUI transmission of optical fibre, providing advantages in terms of power consumption, edge and board density over competing solutions. The transmit section converts parallel electrical input signals via a laser driver and a VCSEL array into parallel optical output signals at a wavelength of 850 nm. The receive section converts parallel optical input signals via a PIN photodiode array and a transimpedance and limiting amplifier, into electrical output signals. The module is fitted with two pluggable industry-standard connectors. For the electrical interface, a 100 position FCI MegArray(R) receptacle is used. For the optical interface, an industry-standard MTPTM(MPO) connector is used, which is compliant with IEC 61754-7. This provides ease of assembly on the host board and enables provisioning of bandwidth on demand. Reliability assurance is based on Telcordia GR-468-CORE and the parts are compliant to the EU directive 2002/95/EC issued 27 January 2003 [RoHS].
Exemption 6 & 7
2
Zarlink Semiconductor Inc.
ZL60304
Shortform Data Sheet
Classified in accordance with IEC 60825-1/A2:2001, IEC 60825-2: 2000 Class 1 M Laser Product Emitted wavelength: 840 nm
Module front view - MTP key up Tx0 Tx1 Tx2 Tx3 - - - - Rx3 Rx2 Rx1 Rx0 Host printed circuit board Table 1 - Transceiver Optical Channel Assignment
3
Zarlink Semiconductor Inc.
NOTES:1. All dimensions in mm. 2. Tolerancing per ASME Y14.5M-1994. A C
A10 18,16
A1
n0,58 0,05
7,48
j n0,05 A B-C
2-56 UNC-2B
13,72 17,5 1,145
n2,5
j n0,15m A B-C
n3,63
B
2-56 UNC-2B 3,50 Deep MIN 36,87
j n0,15m A j n0,15m A B-C
n1,3
j n0,15m A B-C
FRONT VIEW ( 2 : 1 )
27,64
12,23 3,26
7,55
14,4
30,23 31,75
0,76
0,98
4,3
12,5
Projection Method
(c) Zarlink Semiconductor 2002. All rights reserved.
Package code Previous package codes
Drawing type
ISSUE ACN DATE
1
2
3
MJ
JS004296R1A JS004296 rev.2 JS004296 rev.3
Package Drawing - Module Layout Title
12-JUN-03 24-JAN-04 24-JAN-05
APPRD. TD/BE
MD/MA
MD/MA
JS004296
(n2,69 0,12 Hole)
17,5 14,4 Max product outline Component keep-out area.
j n0,1 A B-C
n1,70 0,12 Holes
j n0,1 A B-C
n3,00 MIN pads, Keep Out
j n0,1 A B-C
n0,58 0,05 Pads
K1
A1
35,31 0,75
K10
A10
18,16
n2,69 0,12 Hole
j n0,1 A
n4,30 MIN pads (3x), Keep Out
B
C
NOTES:1. All dimensions in mm. 2. Tolerancing per ASME Y14.5M-1994.
(c) Zarlink Semiconductor 2002. All rights reserved.
1,145 A 13,72
Projection Method
5,15 0,25
j n0,1 A B-C
Package code Previous package codes
Drawing type
30,23
j n0,05 A B-C
31,75
ISSUE ACN DATE
1
2
3
MJ
JS004296R1A JS004296 rev.2 JS004296 rev.3
12-JUN-03 24-JAN-05 14-FEB-05
APPRD. TD/BE
Package Drawing, Host Circuit Board Footprint Layout Title
MD/MA
MD/MA
JS004296
For more information about all Zarlink products visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request.
Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE

▲Up To Search▲

Price & Availability of ZL6030407

	To Download ZL6030407 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .